Invensas Licenses xFDTM Technology, will be Demonstrated in UltrabooksTM at CES 2013
Invensas Licenses xFDTMTechnology, will be Demonstrated in UltrabooksTMat CES 2013
SAN JOSE, Calif.--(BUSINESS WIRE)-- Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (NAS: TSRA) , announced today that its new xFD "DIMM-in-a-Package™" memory technology has been licensed to an original equipment manufacturer (OEM), and this technology will be demonstrated in Intel-based Ultrabooks™ at CES 2013. These Ultrabooks contain SK hynix memory chips packaged with Invensas' xFD "DIMM-in-a-Package" memory technology and were built by a leading manufacturer of personal computers. Invensas will showcase the new Ultrabooks at the upcoming Pepcom Digital Experience event being hosted at CES 2013 in Las Vegas.
The DIMM-in-a-Package technology replaces Small-Outline-Dual-Inline-Memory-Modules (SODIMMs), traditionally used in notebook computers, with semiconductor package components that are approximately 80% smaller and offer significant cost and performance benefits. The product is designed to support standard Double-Data-Rate (DDR3 and DDR4) DRAM and Mobile DRAM chips, as well as Intel and ARM based processor architectures.
"We are delighted to be demonstrating our xFD 'DIMM-in-a-Package solution' at CES 2013 in partnership with a leading OEM and its manufacturing partners," said Simon McElrea, president of Invensas. "Our xFD solution provides significant system cost reduction, as well as size, power and performance benefits. The most innovative aspect of the technology is that it is the first solution to enable co-support of commodity DRAM and mobile DRAM, including Intel or ARM integration, within the same memory package. This significantly simplifies the design and BOM complexity for companies planning multiple notebook and tablet launches."
For more information on xFD see "A multi-die DRAM package for solder-down memory in Ultrabook and Tablet PC applications," co-authored by Dell, Inc. and presented in April 2012 at the International Conference on Electronics Packaging (ICEP) in Japan.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, performance, characteristics and benefits of Invensas products and technology, the participation by Invensas at the Pepcom Digital Experience event at CES 2013, the subject matter of the presentations by Invensas at that event, and the business and/or commercial relationships between Invensas and third parties. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the "Company"); the Company's businesses; market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses, including the integration by DigitalOptics Corporation ("DOC") of its recently acquired camera module manufacturing facility in Zhuhai, China; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; failure by DOC to become a vertically integrated camera module supplier; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2011, and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2012, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
About Invensas Corporation
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), is a global leader in semiconductor interconnect solutions and intellectual property. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California, Invensas licenses these solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and delivers the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact Invensas PR at +1 408 324 5105.
Rick Neely, 408-321-6756
Chief Financial Officer
Amy Smith, 401-369-9266
KEYWORDS: United States North America California Nevada
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