Invensas Demos New High Bandwidth Packaging Solution for Mobile Devices at 2013 ECTC, Las Vegas
SAN JOSE, Calif.--(BUSINESS WIRE)-- Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (NAS: TSRA) , will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013. The solution was brought to high volume market readiness in collaboration with Kulicke & Soffa Industries, Inc. (K&S), Universal Instruments Corporation, and Celestica Inc., all leaders in their respective industries.
"The BVA platform provides smartphone and tablet makers with a roadmap to much higher bandwidth and lower power consumption, enabling high definition mobile gaming, multi-channel video, and a host of new data-rich applications on next generation mobile devices," said Simon McElrea, president of Invensas Corporation. "With greater than 1,000 interconnects, twice that of the current competition, in a tiny 14x14mm package-on-package form factor, BVA is by far the mobile industry's highest bandwidth solution."
The technology, which relies on conventional manufacturing infrastructure, enables the interconnection of System on Chip (SOC), Central Processing Unit (CPU), and Graphics Processing Unit (GPU) chips with their associated memory chips. It accommodates Double Data Rate 3/4 (DDR3/4 ) DRAM, Low Power Double Data Rate (LPDDR) and "Wide-IO" DRAM, as well as Flash and Multi Chip Package (MCP) memory. 512 bit memory bus width is supported which, at 800MHz operation, delivers an unprecedented 100GB/s bandwidth.
Invensas will display the technology in Booth #114 at the 2013 ECTC in the Cosmopolitan Hotel, Las Vegas, NV, on May 28 - 31, 2013. In addition, Invensas will present a white paper "Package-on-Package with Very Fine Pitch Interconnects for High Bandwidth" on Thursday May 30, 2013 at 4:45pm PT. More details on BVA and additional Invensas mobility solutions can be found at www.invensas.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, performance, characteristics and benefits of Invensas products and technology, the participation by Invensas at the IEEE Electronic Components & Technology Conference, the subject matter of the presentations by Invensas at that event, the characteristics, benefits, and features of BVA and the business relationships and collaborations between Invensas and third parties. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the "Company"); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report on Form 10-Q for the quarter ended March 31, 2013, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.
About Invensas Corporation
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), is a global leader in semiconductor interconnect solutions and intellectual property. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California, Invensas licenses these solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and delivers the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact Invensas PR at +1 408 324 5105.
Tessera Technologies, Inc.
Rick Neely, 408-321-6756
Chief Financial Officer
Amy Smith, 401-369-9266
KEYWORDS: United States North America California Nevada
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