IHS GlobalSpec Electronic Components & Product Design Online Event Now Available On Demand


IHS GlobalSpec Electronic Components & Product Design Online Event Now Available On Demand

Provides engineers and industrial professionals easy access to event's educational presentations and information

EAST GREENBUSH, N.Y.--(BUSINESS WIRE)-- The March 27 Electronic Components & Product Design online event hosted by IHS GlobalSpec, recently acquired by IHS Inc. (NYS: IHS) , drew more than 900 participants, with nearly all attendees reporting they are decision makers within their organizations. The free online session is now available on demand to give engineers and industrial professionals easy access to educational presentations and industry-leading supplier resources from the live-day event.

IHS GlobalSpec's Electronic Components & Product Design online event provided opportunities to learn of the latest trends and technologies shaping the electronics systems that drive innovation in today's consumer electronics, medical equipment and automotive markets. Participants were also able to find out what's happening with processors and IP cores, wireless networking protocols, power management, battery technologies and user interface and display innovations. By attending this event, attendees networked with their peers and suppliers, participated in key educational sessions and learned how to help their companies remain competitive in today's rapidly changing electronics marketplace.

Industrial professionals took advantage of these learning and networking opportunities from the convenience of their desktops, without having to budget for travel expenses or lose time away from the office.

"Industrial professionals who attended our Electronic Components & Product Design online event heard from experts on some of the latest trends shaping the electronics industry and connected with leading suppliers on cutting-edge innovations and technologies in the marketplace," said Donna Lewis, director of e-publishing and e-events for IHS GlobalSpec. "Our exhibitors took advantage of this unique opportunity to share their products and solutions with a highly engaged audience."

The event was sponsored by ECIA, the Electronic Components Industry Association. Speakers and topics included:

  • More Effective Design Approach for Power-sensitive Embedded Systems
    This presentation looked at how software has become the key contributor to minimizing power consumption in embedded devices. Historically, power was purely a hardware issue, but with sophisticated designs, often for hand-held, battery-powered equipment, a system-wide approach is needed.
    Presented by Colin Walls, embedded software technologist, Mentor Graphics

  • The Future of NOR Flash
    This presentation provided an understanding of how NOR Flash has evolved from a bus interface and offered a performance perspective and comparison with other memory technologies. Future innovations that will keep NOR memories relevant for the foreseeable future were also discussed.
    Presented by Cliff Zitlaw, fellow, Spansion Inc.

  • Trends in Wireless Connectivity
    This presentation offered a review of popular wireless protocols with their latest trends and updates, including Wi-Fi, Bluetooth, and ZigBee.
    Presented by Joe Tillison, director of business development, Western Americas, Bluegiga Technologies

  • Multicore Software Development for Embedded Systems
    This presentation was an overview of the various software development techniques, processes, and challenges for multicore processing in the embedded systems space. Software programming models, embedded multicore software architectures, multicore system integration and debugging topics were also discussed. Practical advice was given based on industry case studies.
    Presented by Robert Oshana, director, software research and development, Freescale Semiconductor

Companies exhibiting at this event included: Interpower Corporation; PHOENIX CONTACT USA; Schroff; IHS Inc.; ITT Cannon; METZ CONNECT USA Inc.; Rose+Bopla Enclosures; and TTI, Inc.

For more information on exhibiting opportunities for the Electronic Components & Product Design online event in 2014, download an exhibitor kit or call 800.261.2052.

About GlobalSpec

GlobalSpec, recently acquired by IHS Inc. (NYS: IHS) , is the leading provider of digital media solutions designed to connect industrial marketers with their target audience of engineering, technical, industrial, scientific and manufacturing sector professionals. GlobalSpec provides its registered users with a domain-expert search engine to search more than 50,000 supplier catalogs by specification, a broad range of proprietary and aggregated Web-based content, over 15 annual online events, and more than 70 e-newsletters - helping them search for and locate products and services, learn about suppliers and access comprehensive technical content. For suppliers, GlobalSpec helps generate awareness, demand and engagement opportunities among the professionals they are looking to reach - from inbox to desktop, through networks and via real-time engagement.

About IHS (www.ihs.com)

IHS (NYS: IHS) is the leading source of information, insight and analytics in critical areas that shape today's business landscape. Businesses and governments in more than 165 countries around the globe rely on the comprehensive content, expert independent analysis and flexible delivery methods of IHS to make high-impact decisions and develop strategies with speed and confidence. IHS has been in business since 1959 and became a publicly traded company on the New York Stock Exchange in 2005. Headquartered in Englewood, Colorado, USA, IHS is committed to sustainable, profitable growth and employs more than 6,000 people in 31 countries around the world.

IHS is a registered trademark of IHS Inc. All other company and product names may be trademarks of their respective owners. © 2013 IHS Inc. All rights reserved.

IHS GlobalSpec
Amber Cooleen, 518-880-0200 ext. 5338
Senior Product Marketing Manager

KEYWORDS: United States North America New York


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