Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013

Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Rambus Inc. (NAS: RMBS) :

Rambus engineers will demonstrate and present innovations for future main memory systems at the 2013 International Solid-State Circuit Conference (ISSCC), the premier forum for showcasing advances in solid-state circuits.

The presentation will highlight a single-ended, low-signal swing transceiver that couples high-speed (up to 6.4Gb/s) read/write capabilities with industry leading power efficiency. This technology can satisfy the demand for high-density, low power and high-speed memory interfaces in cloud computing environments.

Demonstration Session Details:

Title: A 6.4Gb/s Near-Ground Single-Ended Transceiver for Dual-Rank DIMM Memory Interface Systems
8:30 a.m. - 9:00 a.m.

For additional details, visit: www.rambus.com.

Rambus Inc.
Carolyn Robinson, 408-462-8717
crobinson@rambus.com
or
Schwartz MSL for Rambus
Dara Sklar or Jason Morris, 415-512-0770
rambus@schwartzmsl.com

KEYWORDS: United States North America California

INDUSTRY KEYWORDS:

The article Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013 originally appeared on Fool.com.

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