Interlink Electronics, Inc. Announces Howard Goldberg Has Joined the Company as Executive Vice Presi

Interlink Electronics, Inc. Announces Howard Goldberg Has Joined the Company as Executive Vice President of Corporate Development and Strategic Partnerships

CAMARILLO, Calif.--(BUSINESS WIRE)-- Interlink Electronics, Inc. (LINK), a publicly traded company, announced that Howard Goldberg has joined the company as Executive Vice President of Corporate Development and Strategic Partnerships. Mr. Goldberg's responsibilities include corporate business development and in particular supporting investor relations, mergers and acquisitions, strategic product development and partnerships.

"Howard brings 18-years of executive leadership experience in General Management, Business Development, Mergers & Acquisitions, and Product Development," said Mr. Steven N. Bronson, Chief Executive Officer. "This addition to the team is part of our continued investment in the company to sustain and accelerate the momentum we have gained over the last year."

"Mr. Goldberg's broad experience and proven track record of successfully introducing product and service solutions across diverse industries will be critical as we continue to execute our long term growth plans," added Mr. Declan Flannery, Chief Operating Officer.

Mr. Goldberg was most recently, President of Supply-Chain Services for DEX, Inc. DEX provides high-tech product repair and supply-chain solutions to Fortune-500 clients. Mr. Goldberg was accountable for global P&L, operations, and engineering for a Division that consisted of (7) plants located in (5) countries. Prior to DEX, Mr. Goldberg was Executive Vice President and General Manager of Rx Timer Cap, LLC, where he oversaw global operations and product development. Rx Timer Cap operates in the pharmaceutical compliance aids arena. He worked with the CEO to close a Series A financing round, led APAC supply-chain teams to successfully address final product improvements prior to high-volume production ramp, and championed efforts to file patent applications and additional product trademark applications. Additionally, Mr. Goldberg has also held Executive Vice President Business & Operations, Business Unit Manager, Business Development, and Engineering Director role at Colibrys, Inc. (formerly Applied MEMS, Inc.) offering micro-machined silicon smart-sensor solutions that revolutionized energy exploration, defense and aerospace, process control, and telecommunications industries. He successfully drove efforts to evolve the company from an R&D center, to Business Unit, to ultimate spin-off and acquisition by a Swiss parent company to become its North American regional headquarters.

Mr. Goldberg holds both a Ph.D. and M.S. degree in Electrical Engineering from the University of Michigan with an emphasis in MEMS sensor technologies. Mr. Goldberg earned his B.S. in Electrical Engineering with high honors from Lehigh University. He was also selected to conduct post-doctoral research in MEMS at MIT. He is the co-inventor on eight patents and one patent pending.

About Interlink Electronics, Inc.

Interlink Electronics, Inc. (OTC: LINK) is a sensor technology company and one of the world's leading innovators of intuitive interface design. With numerous patents around the world protecting its technologies and products, Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California and offices in Japan, Hong Kong and China. For more information, see http://www.interlinkelectronics.com.

This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink, historical weaknesses in internal controls over financial accounting, the continued availability at competitive prices of raw materials for our products, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.

Interlink Electronics
For Investor Relations:
Steven N. Bronson, +1 805-484-8855 ext.112
CEO
sbronson@interlinkelectronics.com

KEYWORDS: United States North America California

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