Interlink Electronics Introduces "Out of the Box" Sensor Solutions for Next-Generation Products
Interlink Electronics Introduces "Out of the Box" Sensor Solutions for Next-Generation Products
CAMARILLO, Calif.--(BUSINESS WIRE)-- Interlink Electronics, Inc. (OTC: LINK) announced today the launch of their new Hardware Development Kits that offer out of the box sensor technologies solutions, ready to be implemented in all next generation products that require force & position sensors and mouse & pointing solutions.
Packaged for testing and learning about FSR® technology, the Hardware Development Kits (HDKs) provide all the necessary components for engineers and developers to realize their own designs.
The Hardware Development Kits include:
The FSR® 400 series kit - ideal for implementation in human touch control of electronic devices such as automotive electronics, medical systems and industrial PCs. Force Sensing Resistors (FSR®) are robust, polymer thick film (PTF) devices that exhibit a decrease in resistance when increased pressure is applied to the surface of the sensor.
The VersaPad® kit includes a versatile touchpad module intended for integration by OEMs into laptops, military and rugged computers, panel PCs and medical devices. With smoothness and sensitivity internally enhanced by true pressure measurement, it offers all customary mouse functions - mousing, tapping, dragging, and scrolling. The module's tough, moisture and grime resistant surface can be used with a finger or stylus, even in wet or dirty environments and it operates over an extended temperature range of -20°C to +60°C.
The 4-zone mousing Hardware Development Kit (HDK) is the perfect tool to evaluate this unique mouse pointing solution. The HDK provides all the necessary components to understand and evaluate how to implement accurate 360-degree mouse control.
The Ring Sensor kit enables intuitive scrolling and menu navigation functionality for consumer electronic devices in an easy to integrate, high resolution, ultra low-power package. It is ideal for media players, mobile phones, control panels, medical instruments, and home entertainment devices to control streaming media, audio, balance, menus, play lists and gaming functions that involve rotation and steering. The sensor can be integrated directly into the device's host processor without the need for a dedicated microprocessor.
The Interlink Force Sensing Linear Potentiometer (FSLP) is a linear position sensor for menu navigation and control. It functions as a linear potentiometer with the ability to detect a user's force for high rate scrolling and a more intuitive user experience. The FSLP is an easy to integrate, high resolution, ultra low-power package.
The MicroModule is a finger-actuated "mouse" pointing module that provides complete 360-degree directional control and accurate speed control simultaneously. It is ideal for computer cursor control in rugged mobile computers, hardened keyboards, navigation systems, machine control panels, pan and tilt controllers, motion controllers, CNC controllers and medical control equipment. It's a durable, maintenance-free "miniature" solution that works well in tight spaces and is capable of delivering "mouse" lifetimes of more than 3 million actuations.
The Micro Joystick Hardware Development Kit (HDK) includes the high-precision Micro Joystick solution which is an innovative, intuitive, OEM pointing system that delivers simultaneous 360-degree control of direction and speed at the touch of a fingertip.
"Our objective with these development kits was to make it simple for designers and engineers to understand the versatility, simplicity and ease of use of our technology," said Declan Flannery, Chief Operating officer of Interlink Electronics."In today's competitive environment short development time can provide a critical advantage.The kits will save designers and engineers valuable time, effort and money while at the same time shortening the product development cycle."
The out of the box Hardware Development Kits from Interlink Electronics are turnkey solutions for any engineer or developer ready to design a successful next generation product. For more information go to: http://www.interlinkelectronics.com/products.php
About Interlink Electronics, Inc.
Interlink Electronics, Inc. (OTC: LINK) is a sensor technology company and one of the world's leading innovators of intuitive interface design. With numerous patents around the world protecting its technologies and products, Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California and offices in Japan, Hong Kong and China. For more information, see http://www.interlinkelectronics.com.
This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink, historical weaknesses in internal controls over financial accounting, the continued availability at competitive prices of raw materials for our products, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.
Interlink Electronics
For Investor Relations:
Steven N. Bronson, +1 805-484-8855 ext. 112
CEO
sbronson@interlinkelectronics.com
or
For information on Interlink Electronics' Hardware Development Kits:
Paul Kelley, +1 805-436-0271
Global Sales Manager
pkelley@interlinkelectronics.com
KEYWORDS: United States North America California
INDUSTRY KEYWORDS:
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